SEMICONDUCTOR PACKAGING TOOLING
IC Tray Injection Molds
Precision tray tooling with component-matched pockets, controlled stack interfaces and a defined handling-validation plan.
Design around the package and equipment
We support molds and trial development for customer-specific and specified standard-format IC trays. Package families in our product scope include BGA, QFN, QFP and related IC or module formats. The actual package drawing, lead geometry, pocket arrangement and equipment interface determine the tool. A familiar tray outline does not establish compatibility with every package or handler.
Details in the tooling review
Review pocket clearances, support points, lead protection, component orientation, stacking and separation, flatness and identification. Resin selection is tied to the required temperature, electrical behavior, cleanliness and dimensional conditions. The mold review covers cavity layout, forming details, flow and thermal control, ejection and replaceable components. Material grade and finished-tray validation remain separate from the steel-component inspection.
| Package data | Full package drawing, maximum envelope, leads or balls, orientation and protected areas. |
| Tray definition | Applicable format/drawing revision, matrix layout, stack features, handling interfaces and identification. |
| Material targets | Grade or selection objective, temperature exposure, specified ESD properties and test conditions. |
| Tool and trial | Tool-only or molding supply, sample quantity, receiving equipment and required trial records. |
| Acceptance | Dimensions, flatness, pocket fit, stacking, actual handler evaluation and specified material/function tests. |
Validate the tray as a handling product
Use representative components and the intended handling equipment when assessing fit, orientation and separation. Evaluate flatness and dimensions under the agreed conditioning and temperature sequence. Where ESD performance is required, specify the measured property, method, limits and relevant conditioning. We do not treat the word conductive or a resin datasheet as complete tray qualification.
Ownership, variants and delivery
New development, pocket revisions and tool delivery can be scoped independently. Existing customer-owned geometry or tooling is not made available for unrelated projects. The order defines drawing ownership, approved revisions, spare components, inspection records and protected packing. Trial quantities and later replenishment requirements should be stated separately to choose a practical tool and production route.
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